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Dr. Gregory Denbeaux (University at Albany, College of Nanoscale Science and Engineering), "Next Generation Lithography for Advanced Semiconductor Device Fabrication"

Date: 04/18/13
Time: 4:30-5:30 p.m.
Audience: Public
Sponsored By: School of Science and Engineering
Location: Coykendall Science Building Auditorium
Contact: Dr. Julio Jorge Gonzalez, x3724, gonzalj@engr.newpaltz.edu

The microprocessors and memory that enable computers, smartphones, and other devices come from semiconductor industry manufacturing with lithography. The semiconductor industry continues to push to make smaller features with lithography to enable more powerful devices for our everyday use. The likely next generation lithography technology to continue that trend toward smaller, more powerful computing components is extreme ultraviolet lithography. This technology is significantly different from the existing leading-edge immersion lithography used currently, partly since it requires plasma sources for the extreme ultraviolet radiation, requires vacuum for the transmission of the radiation, and requires multilayer coated reflective masks and optics for the imaging. With changes come new challenges. This talk will focus on the technology of extreme ultraviolet lithography and the technical challenges needed to be overcome before it can be applied to making the devices that we use in our everyday life.